two in the LED junction

 Figure 2: two in the LED junction - ambient heat flow path: LED encapsulation glue fixed on MCPCB

LED Bulb 

For steady-state modeling, the package thermal characteristics can be thJC R, the junction - case Thermal resistance to accurately describe, junction - case Thermal resistance refers to itself from the LED chip package thermal resistance between the surface of the heat sink block . For an LED, the thermal resistance can be used for this thermal transient testing equipment in accordance with the double-contact surfaces France [9] to get tested.

  LED Flexi Strip

Figure 3 and Figure 4 shows another thJC R is a test method. This method uses a two-step test is completed on a second level of testing of the LED assembly, this two-step test conditions were:

LED Module

First condition - directly mounted to the cold plate MCPCB

The second condition - cold plate in between MCPCB and add a thin layer of plastic film