1, LED light-emitting principle is the electrons pass through a layer of semiconductor material to MR16 stimulate the semiconductor material converts electrical energy into light energy. However, the semiconductor light-emitting layer is weak, so many layers to single layer of material together, and pressed into similar Lapis kind of composite material, which is the "wafer."
Therefore, LED luminous efficiency depends on the same thickness, the number of layers can be pressed into. The thinner the layer material, more layers can be superimposed, the higher luminous efficiency. Thickness of each layer is now generally only 2-20 microns, which also LED Flexi determines the entire LED epitaxial wafer production is the production process is the most difficult part.
2, the cutting - LED Core: equivalent to the material out from the tungsten filament, the difference is, after cutting the wafer is a block shape.
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