During electrical - thermal co-simulation, it is usually not only want to know the temperature LED Downlight changing circumstances, but also want to know the temperature on the electrical waveform transients. Our recent extends the capabilities of the instrument, the instrument is suitable for extended fixed at any base plate is used to generate a semiconductor element for electrical - thermal simulation of DCTM model. The substrate for the N-port network model can be used and chip network model calculated in the same way. In the package was created using DCTM model itself, its N-port network model should also be taking into account the structure of the model pin impact.
The DCTM model into the substrate corresponding to the component pin position and the element itself power - thermal model of the junction between the positions corresponding to, and then to electricity - thermal simulation tools for solving calculations.
LED models with different structures
For the LED, its heating power should be equal to the total input power minus the effective luminous power, the heat should be attached to the package is simply
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